Stacked package device with interconnected conductive bumps

A stacked package comprising:

• a first package;
• a second package connected to the first package in a stacked management, the second package comprising:
• a first substrate having an outer surface and an inner surface opposite to each other, the outer surface electrically connected to the first package, and a first flip-chip electrically mounted on the inner surface;
• a second substrate having an outer surface and an inner surface opposite to each other, the inner surface of the second substrate facing the inner surface of the first substrate, and a second flip-chip electrically mounted on the inner surface of the second substrate;
• multiple conductive bumps distributed around the first flip-chip and the second flip-chip and electrically connected between the inner surface of the first substrate and the inner surface of the second substrate;
• and
• multiple external connecting members provided on the outer surface of the second substrate.