Package structure with molding layer and method for manufacturing the same

A package structure, comprising:

• a first redistribution structure;
• a first package component and a second package component attached to a first side of the first redistribution structure and spaced apart from each other;
• an underfill around the first package component and the second package component;
• a first molding layer over the underfill and over the first side of the first redistribution structure, wherein the first molding layer comprises first carbon-made particles, wherein a thermal conductivity of the first molding layer is greater than a thermal conductivity of the underfill;
• and
• a first semiconductor die attached to a second side of the first redistribution structure, wherein the first semiconductor die partially overlaps the first package component and the second package component in a top view.

A method for forming a package structure, comprising:

• forming a redistribution structure;
• disposing a first package component and a second package component over the redistribution structure, wherein the first package component is spaced apart from the second package component by a first space;
• forming an underfill around the first package component and the second package component and in a lower region of the first space;
• forming a first molding layer over the first package component, the second package component, and the underfill, wherein the first molding layer comprises first carbon-made particles;
• and
• partially removing the first molding layer to expose top surfaces of the first package component and the second package component, wherein an upper region of the first space is filled with the first molding layer.