Micro-transfer printing methods

Abstract

A method of micro-transfer printing includes providing a stamp controlled by a motion-control platform and a micro-component source wafer comprising a micro-component disposed over a cavity in a surface of the micro-component source wafer and connected to the micro-component source wafer with a tether. The stamp can contact the micro-component to adhere the micro-component to the stamp. The stamp and the micro-component can be removed from the micro-component source wafer by moving the stamp in a vertical direction orthogonal to the surface and in a horizontal direction parallel to the surface.

Dependencies are inferred from the claim text.