Member for semiconductor manufacturing equipment

A member for a semiconductor manufacturing equipment, comprising:

• a ceramic substrate comprising an upper surface on which a wafer is to be placed, and a lower surface opposite to the upper surface,
• a plug placement hole that vertically penetrates the ceramic substrate,
• a dielectric plug embedded in the plug placement hole, the dielectric plug comprising a lower surface and a gas passage portion penetrating the dielectric plug,
• a first film covering at least a part of the lower surface of the dielectric plug and made of a material having a volume resistivity lower than that of a material constituting the dielectric plug,
• a conductive base plate bonded to the lower surface of the ceramic substrate via a resin adhesive layer,
• a gas passage that passes through the base plate and the resin adhesive layer to supply gas to the gas passage portion of the dielectric plug, and
• a conductive connecting portion provided in the gas passage, the conductive connecting portion comprising an upper end electrically connected to the first film and a lower end electrically connected to the base plate;
• wherein at least a part of the first film is in contact with the resin adhesive layer, and/or at least a part of the lower surface of the ceramic substrate is covered with a second film made of a material having a volume resistivity lower than that of a material constituting the ceramic substrate, and at least a part of the second film is in contact with the resin adhesive layer and also in contact with the first film.