Semiconductor device manufacturing method and semiconductor device manufacturing system
AssigneeTokyo Electron Limited
InventorsRio SHIMIZU, Tatsuya YAMAGUCHI
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Abstract
A semiconductor device manufacturing method includes: a) embedding a sacrificial material in a recess formed in a substrate; b) covering the recess in which the sacrificial material is embedded with a sealing film; and c) decomposing the sacrificial material in the recess by turning a processing gas into plasma outside the recess and supplying active species contained in the plasma to the sacrificial material via the sealing film, and removing the sacrificial material in the recess via the sealing film.
Claims11
A semiconductor device manufacturing method, comprising:
- a) embedding a sacrificial material in a recess formed in a substrate;
- b) covering the recess in which the sacrificial material is embedded with a sealing film;
- and
- c) decomposing the sacrificial material in the recess by turning a processing gas into plasma outside the recess and supplying active species contained in the plasma to the sacrificial material via the sealing film, and removing the sacrificial material in the recess via the sealing film.
A semiconductor device manufacturing system, comprising:
- a first processing apparatus;
- a second processing apparatus;
- a third processing apparatus;
- and
- a controller configured to control the first processing apparatus, the second processing apparatus, and the third processing apparatus,
- wherein the controller executes:
- a) by using the first processing apparatus, embedding a sacrificial material in a recess formed in a substrate;
- b) by using the second processing apparatus, covering the recess in which the sacrificial material is embedded with a sealing film;
- and
- c) by using the third processing apparatus, decomposing the sacrificial material in the recess by turning a processing gas into plasma outside the recess and supplying active species contained in the plasma to the sacrificial material via the sealing film, and removing the sacrificial material in the recess via the sealing film.
Dependencies are inferred from the claim text.