Multi-stack spark plasma sintering parallel manufacturing
AssigneeAts IP, LLC
InventorsJake PEREZ, Ion BASA, Kelly ADAMS
Life of this patent
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AssigneeAts IP, LLC
InventorsJake PEREZ, Ion BASA, Kelly ADAMS
Estimating the term…
Systems and methods herein provide for an increased throughput and consistency of the spark plasma sintering (SPS) process. One SPS system includes an electrical energy source, and a first SPS module that includes a first die operable to shape a first wafer, and first and second punches operable to compress the first wafer into the first die using electrical energy from the electrical energy source. A second SPS module is stacked atop the first SPS module. and includes a second die operable to shape a second wafer; and third and fourth punches operable to compress the second wafer into the second die using electrical energy from the electrical energy source. The system also includes a controller operable to independently provide the electrical energy from the electrical energy source to each of the first and second SPS modules to provide a substantially even thermal distribution through the first and second wafers.
A Spark Plasma Sintering (SPS) system, comprising:
A method, comprising:
A non-transitory computer readable medium operable with a processor in a Spark Plasma Sintering (SPS) system comprising a first SPS module that comprises a first die and first and second punches, said first die having a semiconductor material deposited therein, the SPS system further comprising a second SPS module that comprises a second die and third and fourth punches, said second die having a semiconductor material deposited therein, the computer readable medium comprising instructions that, when executed by the processor, direct the processor to:
Dependencies are inferred from the claim text.