A Module

A method of manufacturing a module, the method comprising:

• providing a package substrate;
• forming a plurality of conductive lines in the package substrate;
• attaching a first semiconductor chip to the package substrate by flip chip attachment;
• attaching a ball grid array packaged semiconductor chip to the package substrate;
• and
• attaching a connection component to the package substrate, the connection component comprising an electrical coupling configured to couple the package substrate to a corresponding connection component on a motherboard;
• wherein the plurality of conductive lines electrically connect the first semiconductor chip to the ball grid array packaged semiconductor chip and the connection component.

A module comprising:

• a package substrate having an upper side and a lower side;
• a first flip chip-attached fabric chip attached to the upper side of the package substrate, wherein the first flip chip-attached fabric chip includes routing logic;
• a first ball grid array-attached Random Access Memory (RAM) chip attached to the upper side of the package substrate;
• wherein the routing logic and the first ball grid array-attached RAM chip are in electrical communication with each other by a plurality of conductive lines within the package substrate;
• and
• a first connection component attached to the lower side of the package substrate, the first connection component comprising an electrical coupling configured to couple the package substrate to a second connection component on an external board, wherein the first connection component is in electrical communication with the routing logic and the first ball grid array-attached RAM chip by the plurality of conductive lines.