Microelectromechanical sensor with external fluidic coupling having contamination-reducing structure

A process for manufacturing a microelectromechanical sensor, the process comprising:

• in a supporting body containing semiconductor material, defining:
• a sensing structure including a measuring chamber and a sensitive element facing the measuring chamber;
• fluidic paths having an access section to the measuring chamber;
• and
• trapping structures in communication with respective fluidic paths;
• bonding a cap of semiconductor material to the supporting body, the cap having an internal surface arranged facing the supporting body;
• forming, in the cap, a plurality of inlet holes in fluidic communication with respective fluidic paths;
• wherein the trapping structures extend in the supporting body at least partially at a greater distance, from the internal surface of the cap, with respect to the access section of each of the fluidic paths.

A device comprising:

• a supporting body;
• a cap coupled to the supporting body, the cap including a plurality of inlet holes;
• a sensing structure on the supporting body, the sensing structure including:
• a sensitive element in the supporting body;
• and
• a measuring chamber positioned between the sensitive element and the cap;
• fluidic paths that fluidically couples the sensing structure to the plurality of inlet holes;
• and
• trapping structures in the supporting body, each of the plurality of inlet holes overlying at least one of the trapping structures.