Multi-layer vacuum electron device and method of manufacture

A method for fabricating a plurality of vacuum electron devices, the method comprising:

• forming from a first non-magnetic electrically conductive material a first non-magnetic conductor plate having a first external surface and a first internal surface;
• forming a first alignment feature in the first non-magnetic conductor plate;
• forming from a second non-magnetic electrically conductive material a second non-magnetic conductor plate having a second external surface and an second internal surface;
• forming a second alignment feature in the second non-magnetic conductor plate;
• forming first and second radio-frequency (RF) interaction zones in spaced apart relationship in each of a plurality of electrically conductive non-magnetic interaction structure forming plates;
• forming a third alignment feature in each of the plurality of non-magnetic interaction structure forming plates;
• stacking the plurality of electrically conductive non-magnetic interaction structure forming plates using the plurality of third alignment features to form an RF interaction structure, the first RF interaction zones together forming a first RF interaction region for transmitting a first electron beam, the second RF interaction zones together forming a second RF interaction region for transmitting a second electron beam;
• disposing the first non-magnetic conductor plate, the RF interaction structure, and the second non-magnetic conductor plate in a stack using the first alignment feature, the second alignment feature and one or more of the plurality of third alignment features, such that the first external surface of the non-magnetic conductor plate and the second external surface of the second non-magnetic conductor plate are outside of the stack;
• and
• bonding the first non-magnetic conductor plate, the RF interaction structure, and the second non-magnetic conductor plate together.