Electronic device and fabrication method thereof

A method for fabrication of electronic device comprising,

• depositing a multi-lobe differential inductor having two terminals on a P-substrate, wherein the inductor comprises side-lobes (L1, L3) coupled with a main coil (L2) on a first side and a second side;
• positioning a ground ring (M5) around the inductor at a predetermined distance on the substrate and configuring the ground ring with a grounded polarity;
• coupling a broken ring with the ground ring (M5) while positioning the broken ring around a perimeter of the substrate such that the inductor is surrounded between the ground ring and the broken ring;
• wherein the broken ring defines a plurality of parallelly arranged structures, each structure comprises a plurality of metal segments (M1-M4, M6-M10) parallel to and separated by a predetermined distance from each other and electrically connected to and perpendicular to the ground ring.