Co-packaged optics device and opto-electronic module

An opto-electronic module, comprising:

• a co-packaged optics device comprising:
• a package substrate;
• an electronic component disposed on the package substrate;
• optical transceivers disposed on the package substrate, arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceivers;
• and
• a waveguide component disposed on the package substrate, wherein the waveguide component has an inward surface facing the optical transceivers;
• a first fiber array unit attached to the waveguide component;
• and
• a second fiber array unit attached to the waveguide component, wherein at least one of optical fibers of the first fiber array unit and at least one of optical fibers of the second fiber array unit communicate to a same one of the optical transceivers through the waveguide component.

A co-packaged optics device comprising:

• a package substrate;
• an electronic component disposed on the package substrate;
• optical transceivers disposed on the package substrate, arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceivers;
• a waveguide bulk disposed on the package substrate;
• and
• waveguide channels embedded in the waveguide bulk, wherein inward ends of the waveguide channels directing to the optical transceivers and outward ends of the waveguide channels opposite to the inward ends are arranged in different sequences.