Display device and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsHEEYEON PARK, YEONGUK KIM, CHANGYEONG SONG, Hyein JUNG, YONGCHAN JU, JAEHEUNG HA
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Abstract
A display device includes: a circuit layer including a transistor and a plurality of insulating layers, a display element layer disposed on the circuit layer and including a light emitting element electrically connected to the transistor, an inorganic encapsulation film disposed on the display element layer, and a barrier layer directly disposed on the inorganic encapsulation film and containing an inorganic polysilazane compound.
Claims20
A display device comprising:
- a circuit layer including a transistor and a plurality of insulating layers;
- a display element layer disposed on the circuit layer and including a light emitting element electrically connected to the transistor;
- an inorganic encapsulation film disposed on the display element layer;
- and
- a barrier layer directly disposed on the inorganic encapsulation film and containing an inorganic polysilazane compound.
A display device comprising:
- an electronic module;
- and
- a display module including a hole region including a hole defined to overlap the electronic module, and a display region spaced apart from the hole in a plan view,
- wherein the display module includes:
- a base layer;
- a circuit layer disposed on the base layer and including a plurality of insulating layers;
- a display element layer disposed on the circuit layer and including a light emitting element and a pixel defining film;
- a plurality of dam portions disposed on the base layer in the hole region;
- an inorganic encapsulation film covering the display element layer and the dam portions;
- and
- a barrier layer directly disposed on the inorganic encapsulation film and containing an inorganic polysilazane compound.
A method for manufacturing a display device, the method comprising:
- providing a base layer including a hole region in which a through-hole is defined, and a display region adjacent to the hole region;
- forming a circuit layer including a conductive pattern and a plurality of insulating layers on the base layer;
- forming a plurality of dam portions including a dam layer disposed in a same layer as some of the insulating layers, wherein the dam portions define a groove in the hole region;
- forming a display element layer including a light emitting element on the circuit layer;
- forming an inorganic encapsulation film covering the light emitting element and the dam portions;
- and
- forming a barrier layer directly disposed on the inorganic encapsulation film and containing an inorganic polysilazane compound.
Dependencies are inferred from the claim text.