Display device and method of fabricating the same

A display device comprising:

• a substrate comprising a first emission area, a second emission area, and a non-emission area between the first emission area and the second emission area;
• a first light emitting element on the first emission area of the substrate;
• a second light emitting element on the second emission area of the substrate;
• a pixel defining layer on the non-emission area of the substrate and defining a first opening;
• a bank layer defining a second opening on the pixel defining layer;
• a first inorganic layer on the first light emitting element;
• a second inorganic layer on the second light emitting element and spaced apart from the first inorganic layer;
• and
• an organic encapsulation layer on the first inorganic layer and the second inorganic layer,
• wherein the first light emitting element and the first inorganic layer are in contact with one side surface of the bank layer facing the first emission area,
• the second light emitting element and the second inorganic layer are in contact with the other side surface of the bank layer facing the second emission area, and
• the first inorganic layer and the second inorganic layer are spaced apart from each other without overlapping the non-emission area.

A method of fabricating a display device, comprising:

• forming a substrate comprising an emission area and a non-emission area, an anode electrode on the emission area of the substrate and a sacrificial layer on the anode electrode, and forming a pixel defining layer completely covering the sacrificial layer and the substrate, and a bank material layer completely covering the pixel defining layer;
• forming a photoresist on the bank material layer, etching the bank material layer and the pixel defining layer overlapping the anode electrode to expose the sacrificial layer, and then etching a sidewall of the bank material layer and the sacrificial layer to expose the anode electrode and form a bank layer;
• forming a light emitting layer and a cathode electrode on the anode electrode and the photoresist, and forming a first encapsulation layer on the cathode electrode;
• and
• removing the light emitting layer, the cathode electrode, and the first encapsulation layer located in other areas excluding the light emitting layer, the cathode electrode, and the first encapsulation layer located in the emission area and around the emission area,
• wherein in the removing of the light emitting layer and the cathode electrode, a cavity is formed between the first encapsulation layer and the bank layer in a direction perpendicular to the substrate.