Method of packaging and integration for multi-layer system

A method of packaging micro-LEDs onto a substrate, comprising:

• microfabricating one or more micro-LEDs on an optically transparent microdevice substrate with an epitaxial layer between the microdevice substrate and an active layer for light generation;
• aligning a test substrate with one or more test electrodes to connect each of the one or more electrodes to one of the one or more micro-LEDs;
• injecting a current through each test electrode, capturing brightness information from each micro-LED, and creating a map of each healthy and defective micro-LED based on the captured brightness information;
• removing the test substrate with one or more test electrodes;
• coating a photo-sensitive polymer on the microdevice substrate;
• exposing a pattern into the photo-sensitive polymer through optically patterning to remove the photo-sensitive polymer around all defective micro-LEDs;
• forcing a receiver substrate with one or more pads towards the microdevice substrate such that at least one of the pads penetrates the photo-sensitive polymer and makes electrical contact with one of the healthy micro-LEDs, and the photo-sensitive polymer fills any gap between the micro-LED and the receiver substrate;
• curing the photo-sensitive polymer surrounding one of the healthy micro-LEDs in contact with one of the pads, bonding the one of the healthy micro-LEDs to the receiver substrate and achieving lift-off of the micro-LED from the microdevice substrate;
• and
• moving the microdevice substrate away from the receiver substrate.