Display device and manufacturing method thereof

A manufacturing method of a display device, comprising:

• providing a circuit substrate, wherein the circuit substrate has a first sub-pixel, a second sub-pixel, and a third sub-pixel, and each of the first sub-pixel, the second sub-pixel, and the third sub-pixel has a first bonding area and a second bonding area;
• respectively disposing a plurality of first light-emitting elements on the first sub-pixel, the second sub-pixel, and the third sub-pixel, wherein one of the first light-emitting elements is disposed on the first bonding area of the first sub-pixel and is bonded to the circuit substrate through a first solder structure, and another ones of the first light-emitting elements are respectively disposed on the second sub-pixel and the third sub-pixel;
• removing the another ones of the first light-emitting elements and leaving a first residual solder on the first bonding area of the second sub-pixel, and leaving a second residual solder on the first bonding area of the third sub-pixel;
• respectively disposing a plurality of second light-emitting elements on the second sub-pixel and the third sub-pixel, wherein one of the second light-emitting elements is disposed on the second bonding area of the second sub-pixel and is bonded to the circuit substrate through a second solder structure, and another one of the second light-emitting elements is disposed on the third sub-pixel;
• removing the another one of the second light-emitting elements and leaving a third residual solder on the second bonding area of the third sub-pixel;
• and
• disposing a third light-emitting element on the third sub-pixel, wherein the third light-emitting element is connected to the circuit substrate through a first conductive adhesive structure.