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US 2025/0169217 A1Published application
Semiconductor device and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorsTAKANORI OKAMURA, YUI YUGA, KAZUYUKI TOMIDA
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Abstract
Provided is a semiconductor device including: a first substrate (400) including a wiring layer (400T) having an electrode (402) and a semiconductor layer (400S) stacked on the wiring layer; an opening (H4) included in such a manner as to penetrate the semiconductor layer in such a manner as to expose a first region of the electrode; and an insulating film (404) included in the semiconductor layer facing a second region of the electrode not exposed by the opening.
Claims20
A semiconductor device comprising:
- a first substrate including a wiring layer having an electrode and a semiconductor layer stacked on the wiring layer;
- an opening included in such a manner as to penetrate the semiconductor layer in such a manner as to expose a first region of the electrode;
- and
- an insulating film included in the semiconductor layer facing a second region of the electrode not exposed by the opening.
1 more element
An electronic device on which a semiconductor device is mounted,
- wherein the semiconductor device comprises:
- a first substrate including a wiring layer having an electrode and a semiconductor layer stacked on the wiring layer;
- an opening included in such a manner as to penetrate the semiconductor layer in such a manner as to expose a first region of the electrode;
- and
- an insulating film included in the semiconductor layer facing a second region of the electrode not exposed by the opening.
2 more elements
Dependencies are inferred from the claim text.