Semiconductor device having improved electrostatic discharge protection
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSheng-Fu Hsu, Ta-Yuan Kung, Chen-Liang Chu, Chih-Chung Tsai
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSheng-Fu Hsu, Ta-Yuan Kung, Chen-Liang Chu, Chih-Chung Tsai
Estimating the term…
Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a source region and a drain region in a substrate and laterally spaced. A gate stack is over the substrate and between the source region and the drain region. The drain region includes two or more first doped regions having a first doping type in the substrate. The drain region further includes one or more second doped regions in the substrate. The first doped regions have a greater concentration of first doping type dopants than the second doped regions, and each of the second doped regions is disposed laterally between two neighboring first doped regions.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.