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US 2025/0169169 A1Published application
Semiconductor device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsChun-Hao Lin, Hsin-Yu Chen, Shou-Wei Hsieh
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Abstract
A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.
Claims18
A method for fabricating semiconductor device, comprising:
- providing a substrate having a first region and a second region;
- forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region, wherein each of the first fin-shaped structure and the second fin-shaped structure comprises a top portion and a bottom portion;
- forming a shallow trench isolation (STI) around the bottom portions of the first fin-shaped structure and the second fin-shaped structure;
- forming a patterned mask on the second region after forming a first gate structure on the first fin-shaped structure and a second gate structure on the second fin-shaped structure;
- performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different, wherein the process comprises performing an epitaxial growth process to form a semiconductor layer on the first fin-shaped structure;
- and
- transforming the first gate structure and the second gate structure into a first metal gate and a second metal gate.
4 more elements
Dependencies are inferred from the claim text.