Semiconductor device and power amplifier
AssigneeWin Semiconductors Corp.
InventorsChieh-Chih HUANG, Yan-Cheng LIN, Cheng-Kuo LIN, Wei-Chou WANG, Che-Kai LIN, Jiun-De WU
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AssigneeWin Semiconductors Corp.
InventorsChieh-Chih HUANG, Yan-Cheng LIN, Cheng-Kuo LIN, Wei-Chou WANG, Che-Kai LIN, Jiun-De WU
Estimating the term…
A semiconductor device includes: a substrate; a channel layer disposed on the substrate; a barrier layer disposed on the channel layer; and a cap layer disposed on the barrier layer. The semiconductor device further includes: a gate electrode disposed on the barrier layer; a source electrode and a drain electrode disposed on the barrier layer and respectively at opposite sides of the gate electrode; a spike region formed below at least one of the source electrode and the drain electrode; and a passivation layer disposed on the barrier layer and extending onto sidewalls and top surfaces of the source electrode and the drain electrode. The spike region includes titanium nitride (TiN). The passivation layer is in contact with the cap layer.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.