Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsHiro GANGI, Tomoaki INOKUCHI, Yusuke KOBAYASHI, Shotaro BABA, Hiroki NEMOTO, Taichi FUKUDA
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsHiro GANGI, Tomoaki INOKUCHI, Yusuke KOBAYASHI, Shotaro BABA, Hiroki NEMOTO, Taichi FUKUDA
Estimating the term…
A semiconductor device includes a support body, a first conductive part, a second conductive part, a semiconductor layer, a third conductive part, and a fourth conductive part. The semiconductor layer includes a first end surface, a second end surface, a counter region, and a first semiconductor region. The first semiconductor region is of a first conductivity type. The first semiconductor region includes a first upper end region, a first lower end region, and a first intermediate region. The first upper end region includes a portion of the first end surface. The first lower end region includes a portion of the second end surface. A first-conductivity-type impurity concentration in the first upper end region is greater than a first-conductivity-type impurity concentration in the first intermediate region. A first-conductivity-type impurity concentration in the first lower end region is greater than the first-conductivity-type impurity concentration in the first intermediate region.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.