Modulation-doping-based high mobility atomic layer semiconductor device and manufacturing method therefor
AssigneeKorea University Research and Business Foundation
InventorsChul-Ho LEE, Donghun LEE
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AssigneeKorea University Research and Business Foundation
InventorsChul-Ho LEE, Donghun LEE
Estimating the term…
Disclosed are a high-mobility atomic layer semiconductor device based on modulation doping and a method for fabricating the same, which prevent a charge scattering phenomenon caused by ionized impurities by modulation doping dopants such that the dopants are spatially separated from a channel layer of an atomic layer semiconductor device having an atomic layer semiconductor heterojunction structure band-aligned. According to an embodiment of the present disclosure, a high-mobility atomic layer semiconductor device based on modulation doping includes a substrate, an atomic layer semiconductor heterojunction structure band-aligned in type I or type II and including a channel layer allowing movement of an electron and a doping layer, wherein the channel layer and the doping layer are stacked on the substrate, and a dopant formed on the doping layer and including a material for supplying an electron or a hole to the channel layer. The dopant is doped while being spatially separated from the channel layer through the doping layer, instead of being directly doped into the channel layer.
A semiconductor device including an atomic layer for high mobility based on modulation doping, the semiconductor device comprising:
A method for fabricating a semiconductor device including an atomic layer for high mobility based on modulation doping, the method comprising:
Dependencies are inferred from the claim text.