Semiconductor devices and methods of manufacturing thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Ruei Jhan, Kuan-Ting Pan, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Ruei Jhan, Kuan-Ting Pan, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
Estimating the term…
A method includes forming a plurality of fin structures extending along a first direction. The method includes forming a dummy fin structure disposed between two adjacent fin structures. The dummy fin structure also extends along the first direction and includes a deformable layer. The method includes recessing portions of each fin structure. The method includes forming source/drain structures over the recessed fin structures. The method includes deforming the deformable layer of the dummy fin structure to apply either a tensile stress or a compressive stress on the source/drain structures coupled to each of the two adjacent fin structures.
A semiconductor device, comprising:
A semiconductor device, comprising:
A method of fabricating a semiconductor device, comprising:
Dependencies are inferred from the claim text.