Three-dimensional memory devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo-Feng Young, Sai-Hooi Yeong, Han-Jong Chia, Sheng-Chen Wang, Yu-Ming Lin
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBo-Feng Young, Sai-Hooi Yeong, Han-Jong Chia, Sheng-Chen Wang, Yu-Ming Lin
Estimating the term…
In an embodiment, a device includes: a first dielectric layer having a first sidewall; a second dielectric layer having a second sidewall; a word line between the first dielectric layer and the second dielectric layer, the word line having an outer sidewall and an inner sidewall, the inner sidewall recessed from the outer sidewall, the first sidewall, and the second sidewall; a memory layer extending along the outer sidewall of the word line, the inner sidewall of the word line, the first sidewall of the first dielectric layer, and the second sidewall of the second dielectric layer; and a semiconductor layer extending along the memory layer.
A device comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.