Cooling system and communication apparatuses including the system

A communication apparatus, comprising:

• a circuit board, comprising at least one transceiver module;
• and
• a cooling system, comprising:
• a heat sink fin;
• a cooling fluid channel, arranged between the heat sink fin and the at least one transceiver module;
• and
• a cooling fluid drive module, connected to the cooling fluid channel;
• wherein the cooling fluid drive module comprises a fluid circulation drive member, a fluid inlet channel, and a fluid outlet channel;
• an end of the fluid inlet channel and an end of the fluid outlet channel are respectively connected to two ends of the cooling fluid channel, and an another end of the fluid inlet channel and an another end of the fluid outlet channel are connected to the fluid circulation drive member.

A cooling system, used for cooling a plurality of transceiver modules configured in multi-tiered arrangement, the system comprising:

• a plurality of heat sink fins;
• a plurality of cooling fluid channels;
• and
• a cooling fluid drive module, connected to the plurality of cooling fluid channels;
• wherein the plurality of cooling fluid channels are respectively arranged with the plurality of heat sink fins, and one of the plurality of cooling fluid channels is sandwiched between one tier of the plurality of transceiver modules and one of the plurality of heat sink fins.