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US 2025/0168988 A1Published application
Substrate structure
AssigneeUnimicron Technology Corp.
InventorsJeng-Ting LI, Chi-Hai KUO, Cheng-Ta KO, Pu-Ju LIN
Life of this patent
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Abstract
A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.
Claims5
A substrate structure, comprising:
- a glass substrate having a top surface, a bottom surface, and a scribed surface between the top surface and the bottom surface, wherein light transmittance of the scribed surface is lower than light transmittance of either the top surface or the bottom surface;
- and
- a redistribution layer disposed on the glass substrate,
- wherein the scribed surface has an arc profile, and the scribed surface protrudes outward from middle of the glass substrate.
1 more element
Dependencies are inferred from the claim text.