Circuit board and method for mounting electronic component

An electronic component mounting method for mounting an electronic component onto a printed wiring board by soldering,

• the electronic component including
• a body part having a bottom face and a first side face, and
• a terminal board disposed at a bottom portion of the body part,
• the terminal board having
• a first terminal part laterally protruding from the first side face, and
• a second terminal part provided integrally with the first terminal part and positioned at the bottom face,
• the printed wiring board having
• a substrate covered by a solder resist,
• a first pad provided on the substrate, and
• a second pad provided on the substrate so as to be separated from the first pad, wherein
• during a mounting of the electronic component onto the printed wiring board,
• a first solder paste is placed on the first pad and a second solder paste is placed on the second pad,
• the electronic component is disposed on the printed wiring board such that the first terminal part is placed on the first solder paste so as to overlap the first pad, and the second terminal part is placed on the second solder paste so as to overlap the second pad, and
• the printed board is heated and the first solder paste and the second solder paste are melted.