Base member

A base member being a molded component in which pattern wiring is directly formed, the base member comprising:

• land groups for solder mounting of respective electronic components, the land groups being formed on different surfaces of the base member that are not parallel to each other,
• wherein when viewed from a normal direction of a base surface of the base member, at least one of the land groups includes a first land array in which a plurality of lands is arrayed in a first direction and a second land array in which a plurality of lands is arrayed in the first direction, the first land array and the second land array being arranged in a second direction different from the first direction,
• wherein when viewed from the normal direction of the base surface of the base member, the first land array is arranged above the second land array in the second direction, and
• wherein an amount of solder applied to the lands included in the first land array is larger than an amount of solder applied to the lands included in the second land array.

A base member being a molded component in which pattern wiring is directly formed, the base member comprising:

• land groups for solder mounting of respective electronic components, the land groups being formed on different surfaces of the base member that are not parallel to each other,
• wherein when viewed from a normal direction of a base surface of the base member, at least one of the land groups includes a land array in which a plurality of lands is arrayed in a predetermined direction, and
• wherein each of the lands has a structure in which a portion corresponding to an end of a mounting terminal of the electronic component that is on an outer side of the electronic component has a largest width in the predetermined direction,
• wherein when viewed from the normal direction of the base surface of the base member, in a direction orthogonal to the predetermined direction, each of the lands has a smaller width toward an upward direction from the portion corresponding to the end of the mounting terminal of the electronic component that is on the outer side of the electronic component, and
• wherein when viewed from the normal direction of the base surface of the base member, in the direction orthogonal to the predetermined direction, each of the lands has a smaller width toward a downward direction from the portion corresponding to the end of the mounting terminal of the electronic component that is on the outer side of the electronic component.