Printed circuit board and method of manufacturing the same

A method of manufacturing a printed circuit board, the method comprising:

• forming a first through-hole in an insulating layer to penetrate through a portion of the insulating layer from an upper surface of the insulating layer;
• forming a first metal layer filling a portion of the first through-hole;
• forming a second through-hole in the insulating layer to penetrate through another portion of the insulating layer from a lower surface of the insulating layer and exposing a lower side of the first metal layer;
• and
• forming second and third metal layers filling the first and second through-holes, respectively, on the upper and lower sides of the first metal layer.

A printed circuit board comprising:

• an insulating layer;
• a through-hole including a first region penetrating through a portion of the insulating layer from an upper surface of the insulating layer and a second region penetrating through another portion of the insulating layer from a lower surface of the insulating layer to connect to the first region;
• and
• a metal via including a first metal layer disposed in a portion of the first region and a third metal layer disposed below the first metal layer and disposed in the second region,
• wherein in a cross-section, walls of the first region and the second region are inclined in different directions or have a step therebetween.