Electronic component mounting substrate

Abstract

An electronic component mounting substrate includes an electronic component, a printed wiring board that mounts the electronic component thereon, and a cover that accommodates and seals the electronic component mounted on the printed wiring board. The cover has an upper portion and a support portion supporting the upper portion such that the upper portion has a thickness of 2 mm or more, and the printed wiring board includes an upper build-up part and a lower build-up part such that the upper build-up part mounts the electronic component thereon and includes an uppermost resin insulating layer not containing a reinforcing material and that the lower build-up part includes a lowermost resin insulating layer including a reinforcing material.

Dependencies are inferred from the claim text.