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US 2025/0168970 A1Published application
Wiring board
AssigneeKYOCERA Corporation
InventorDaichi SHIMIZU
Life of this patent
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Abstract
A wiring board according to the present disclosure includes an insulation layer having a first surface and a second surface opposite to the first surface, and a first wiring conductor located on the first surface. The first surface of the insulation layer includes a first region having a first arithmetic mean roughness and a second region having a second arithmetic mean roughness. The second arithmetic mean roughness is larger than the first arithmetic mean roughness, and the first wiring conductor is located from the first region to the second region.
Claims10
A wiring board comprising:
- an insulation layer having a first surface and a second surface opposite to the first surface;
- and
- a first wiring conductor located on the first surface,
- wherein the first surface of the insulation layer comprises a first region having a first arithmetic mean roughness and a second region having a second arithmetic mean roughness,
- the second arithmetic mean roughness is larger than the first arithmetic mean roughness, and
- the first wiring conductor is located from the first region to the second region.
3 more elements
Dependencies are inferred from the claim text.