Multilayer Filter, Multilayer Filter Assembly, and Methods for Forming a Multilayer Filter

An assembly, comprising:

• a device having a device substrate and a ground defined on the device substrate;
• and
• a filter attached to the device substrate, the filter comprising:
• a plurality of dielectric layers including an outer dielectric layer, the plurality of dielectric layers stacked in a Z-direction to form a substrate having a top and a bottom, the substrate defining a perimeter, the outer dielectric layer disposed at the top of the substrate,
• a plurality of conductive layers, at least one conductive layer of the plurality of conductive layers formed over a respective one dielectric layer of the plurality of dielectric layers and an outer conductive layer of the plurality of conductive layers formed over the outer dielectric layer, and
• a plurality of vias defined along the perimeter of the substrate, the plurality of vias extending from the outer conductive layer to the bottom of the substrate,
• wherein at least one via of the plurality of vias is electrically connected to the ground.

A method for forming a filter, the method comprising:

• forming a plurality of dielectric layers, the plurality of dielectric layers including an outer dielectric layer;
• forming a plurality of conductive layers, an outer conductive layer of the plurality of conductive layers formed over the outer dielectric layer of the plurality of dielectric layers;
• stacking the plurality of dielectric layers in a Z-direction to form a substrate having a top and a bottom, the outer dielectric layer having the outer conductive layer formed thereover positioned at the top of the substrate, the substrate defining a perimeter;
• and
• defining a plurality of vias along the perimeter of the substrate,
• wherein the plurality of vias extend from the outer conductive layer to the bottom of the substrate.