US 2025/0167192 A1 · INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

Abstract

Disclosed herein is an integrated circuit die stack and an integrated circuit die package assembly having the integrated circuit die stack. The integrated circuit die stack includes first plurality of integrated circuit dice disposed in a first tier of the die stack, and the first plurality of integrated circuit dice include a first integrated circuit die and a bridge die. The integrated circuit die stack further includes a second plurality of integrated circuit dice disposed in a second tier of the die stack, and the second plurality of integrated circuit dice are stacked vertically above the first plurality of the integrated circuit dice of the first tier and include a second integrated circuit die and a third integrated circuit die. The bridge die couples with both the second integrated circuit die and the third integrated circuit die.

Claims20

Dependent claims

An integrated circuit die stack comprising:

a plurality of first integrated circuit dice disposed in a first tier of the integrated circuit die stack, the plurality of the first integrated circuit dice comprising a first integrated circuit die and a bridge die;
and
a plurality of second integrated circuit dice disposed in a second tier of the integrated circuit die stack, the plurality of the second integrated circuit dice stacked vertically above the plurality of the first integrated circuit dice of the first tier, the plurality of the second integrated circuit dice comprising a second integrated circuit die and a third integrated circuit die,
wherein the bridge die couples with both the second integrated circuit die and the third integrated circuit die.

1 more element

Dependencies are inferred from the claim text.

Integrated circuit die stack with a bridge die

Life of this patent

Integrated circuit die stack with a bridge die

Life of this patent

Abstract

Claims20