Stacked electronic packages

A method of forming an assembly, the method comprising:

• receiving a first circuit substrate having a top surface and bottom surface;
• reeving a second circuit substrate having a top surface and bottom surface;
• and
• coupling the first circuit substrate to the second circuit substrate by coupling a first interposer substrate between the first circuit substrate and the second circuit substrate that mechanically couples the first circuit substrate to the second circuit substrate;
• wherein the second circuit substrate is disposed above the first circuit substrate and bonding the second circuit substrate and the bottom surface of the second circuit substrate faces the top surface of the first circuit substrate;
• wherein a first electronic component is mechanically bonded and electrically coupled to the top surface of the first circuit substrate or to the bottom surface of the second circuit substrate;
• and
• wherein the first interposer substrate, the top surface of the first circuit substrate, and the bottom surface of the second circuit substrate jointly define a cavity between the first circuit substrate and the second circuit substrate.