Fan out packaging pop mechanical attach method

A method of fabricating a semiconductor package, the method comprising:

• providing a first die having a top side and a bottom side, and a first sidewall and a second sidewall between the top side and the bottom side, the first sidewall laterally opposite the second sidewall, and the first die having a first conductive pad and a second conductive pad on the top side;
• forming a redistribution layer on the bottom side of the first die, the redistribution layer extending laterally beyond the first sidewall and the second sidewall of the first die;
• forming a mold layer on the redistribution layer and laterally around the first die, the mold layer having a top surface;
• forming a first via in the mold layer and laterally spaced apart from the first sidewall of the first die;
• forming a second via in the mold layer and laterally spaced apart from the second sidewall of the first die;
• forming a third conductive pad coupled to the first via, the third conductive pad having a top surface above the top surface of the mold layer;
• forming a fourth conductive pad coupled to the second via, the fourth conductive pad having a top surface above the top surface of the mold layer;
• providing a second die over the first die and over the first via, the second die coupled to the first conductive pad and the third conductive pad;
• providing a third die over the first die and over the second via, the third die coupled to the second conductive pad and the fourth conductive pad;
• and
• forming a plurality of solder balls beneath and coupled to the redistribution layer, the plurality of solder balls vertically beneath the first die and the mold layer.

A method of fabricating a semiconductor package, the method comprising:

• forming a first redistribution layer;
• providing a first die over the first redistribution layer, the first die having a top side and a bottom side, and a first sidewall and a second sidewall between the top side and the bottom side, the first sidewall laterally opposite the second sidewall;
• forming a mold layer over the first redistribution layer and laterally adjacent to the first sidewall and the second sidewall of the first die;
• forming a first via in the mold layer and laterally spaced apart from the first sidewall of the first die;
• forming a second via in the mold layer and laterally spaced apart from the second sidewall of the first die;
• forming a second redistribution layer on the mold layer and over the first die, the second redistribution layer coupled to the first via and the second via, and the second redistribution layer comprising a first conductive pad and a second conductive pad on and in direct contact with the top side of the first die;
• providing a second die over the first die and over the first via, the second die coupled to the second redistribution layer;
• providing a third die over the first die and over the second via, the third die coupled to the second redistribution layer;
• and
• forming a plurality of solder balls beneath and coupled to the first redistribution layer, the plurality of solder balls vertically beneath the first die and the mold layer.