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US 2025/0167167 A1Published application
Die Stacking with Integrated Thermal Treatment
AssigneeApplied Materials, Inc.
InventorsYing WANG, Ke ZHENG, Raymond HUNG, ChangBum YONG, Guan Huei SEE, Gaurav MEHTA
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Abstract
Methods and apparatus for substrate processing are provided. In some embodiments, a substrate processing method includes: sequentially stacking a plurality of dies on a substrate into a stacked assembly; thermally treating the plurality of dies; and stacking at least one additional die atop the thermally treated plurality of dies.
Claims20
A substrate processing method, comprising:
- sequentially stacking a plurality of dies on a substrate into a stacked assembly;
- thermally treating the plurality of dies;
- and
- stacking at least one additional die atop the thermally treated plurality of dies.
1 more element
An integrated bonder system for processing a substrate, comprising:
- a mainframe comprising a substrate handling system,
- a thermal treatment chamber connected to the mainframe, the thermal treatment chamber configured to perform rapid thermal processing on a substrate and a plurality of dies sequentially stacked on the substrate;
- a bonding chamber connected to the mainframe;
- a plasma chamber connected to the mainframe;
- a wet clean chamber connected to the mainframe;
- and
- a UV chamber connected to the mainframe.
4 more elements
Dependencies are inferred from the claim text.