Electronic package and substrate structure thereof

Abstract

An electronic package and a substrate structure thereof are provided, in which an electronic element is disposed on the substrate structure having a circuit layer, and an insulating protective layer of the substrate structure has an opening that exposes the circuit layer. A plurality of extension portions protruding toward the inside of the opening and spaced apart are formed on the edge of the opening of the insulating protective layer, so that when an underfill material is filled into a space between the electronic element and the substrate structure, the space between the electronic element and the substrate structure can be evenly filled up to prevent the underfill material from forming voids.

Dependencies are inferred from the claim text.