Adhesive structure and manufacturing method thereof, electronic component and manufacturing method thereof, and adhesive layer for transfer

2:

• The adhesive structure according to claim 1, wherein:
• the adhesive structure is a layered adhesive structure.

3:

• The adhesive structure according to claim 1, wherein:
• shapes and sizes of a part of the adhesive portion and a part of the low elastic portion which are exposed on one surface are different from shapes and sizes of another part of the adhesive portion and another part of the low elastic portion which are exposed on another surface.

4:

• The adhesive structure according to claim 1, wherein:
• at least one of the adhesive portion and the low elastic portion has a size of 10 μm or more in a plane direction in the adhesive structure.

5:

• The adhesive structure according to claim 1, wherein:
• a volume ratio of the low elastic portion to the adhesive structure is from 5% to 90%.

6:

• The adhesive structure according to claim 1, wherein:
• the elastic modulus of the low elastic portion is 70% or less of the elastic modulus of the adhesive portion.

7:

• The adhesive structure according to claim 1, wherein:
• the elastic modulus of the low elastic portion is 3,000 MPa or less.

8:

• The adhesive structure according to claim 1, further comprising:
• a thermally conductive portion continuous in a thickness direction.

9:

• The adhesive structure according to claim 1, wherein:
• at least one of the adhesive portion and the low elastic portion contains a photocurable resin.

11:

• An electronic component comprising the adhesive structure according to claim 1.

13:

• The electronic component according to claim 12, wherein:
• a difference in linear thermal expansion coefficient between the first component and the second component is from 0 ppm/K to 20 ppm/K.

14:

• The electronic component according to claim 12, wherein:
• the first component is a heat-generating component or a cooling component, and the second component is a substrate.

15:

• The electronic component according to claim 12, wherein:
• the first component is a semiconductor.

17:

• The method for manufacturing an adhesive structure according to claim 16, further comprising:
• discharging a thermally conductive portion forming ink for forming a thermally conductive portion, from a nozzle, to form the thermally conductive portion continuous in a thickness direction of the adhesive structure.

18:

• The method for manufacturing an adhesive structure according to claim 17, wherein:
• the thermally conductive portion forming ink includes metal nanoparticles, and
• the method further comprises sintering the metal nanoparticles after the discharging of the thermally conductive portion forming ink.

19:

• A method for manufacturing an electronic component, the method comprising:
• fixing a component by using the adhesive structure according to claim 1.