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AssigneeSTMicroelectronics International N.V.
InventorsPierre BAR, Hugo AUDOUIN
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The present description concerns a method of manufacturing an electronic circuit comprising, in the order, the forming on a semiconductor substrate comprising a surface of at least one conductive pad extending over the surface and having sides inclined with respect to the surface, the forming of a first insulating layer on the pad, the deposition of a resin layer and the forming of an opening in the resin layer exposing the entire pad, the plasma etching of the first insulating layer in the opening, which results in the forming of first compounds on the etched edges of the first insulating layer and of second compounds on the pad, the removal of the resin layer, the removal of the first compounds, the removal of the second compounds, and the forming of a second insulating layer on the pad.
A method of manufacturing an electronic circuit, the method comprising:
An electronic circuit, comprising:
13-20. (canceled)
An electronic circuit comprising:
Dependencies are inferred from the claim text.