Package structure

A package structure, comprising:

• a redistribution layer structure, comprising:
• a first dielectric structure;
• and
• a first redistribution layer, embedded in the first dielectric structure and electrically connected to the die, wherein the first redistribution layer comprises a first via and a first trace;
• and
• a second redistribution layer connecting the first redistribution layer, comprising a second via and a second trace, wherein the second via overlaps the first via as seen in a cross-sectional view.

A package structure, comprising:

• a redistribution layer structure, comprising:
• a first RDL, wherein the first RDL comprises a first via and a first trace connected to each other;
• and
• a second RDL, wherein the second RDL comprises a second via and a second trace connected to each other;
• and
• an under-ball metallurgy (UBM), disposed on and electrically connected to the redistribution layer structure,
• wherein the UBM, the second via and the first via overlap as seen in a cross-sectional view.