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US 2025/0167142 A1Published application
Pitch-reducing solder interconnect for rf transitions
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Nikita Mahjabeen
Life of this patent
Estimating the term…
Abstract
A radio frequency (RF) transition mechanism between an integrated circuit (IC) package and an interposer circuit board includes elongated structures to reduce a distance between conductors. Pairs of electrical interconnect pads on the IC package and/or pairs of electrical interconnect pads on the interposer circuit board are elongated on a common axis. The reduced distance between conductors reduces insertion loss at frequencies of interest.
Claims26
A system comprising:
- an integrated circuit device having a first pair of electrical interconnect pads with solderable surfaces;
- and
- an interposer circuit board having a second pair of electrical interconnect pads with solderable surfaces, the second pair of electrical interconnect pads being configured to provide electrical coupling to the first pair of electrical interconnect pads through solder connections, and having a first pair of conductive paths spaced to create a radio frequency (RF) transmission line, wherein the first pair of conductive paths are electrically coupled to the second pair of electrical interconnect pads;
- wherein the first pair of electrical interconnect pads are noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the interposer circuit board.
1 more element
An interposer circuit board comprising:
- a first pair of conductive paths having a first spacing to create a radio frequency (RF) transmission line;
- and
- a first pair of electrical interconnect pads having solderable surfaces configured to be electrically coupled to an integrated circuit device using solder connections, wherein the first pair of electrical interconnect pads have a second spacing greater than the first spacing;
- wherein the first pair of electrical interconnect pads are electrically coupled to the RF transmission line, the first pair of electrical interconnect pads being noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the interposer circuit board.
1 more element
An integrated circuit device comprising:
- a radio frequency (RF) circuit configured to produce RF energy;
- and
- a first pair of electrical interconnect pads with solderable surfaces configured to provide electrical coupling to a circuit board using solder connections;
- wherein the first pair of electrical interconnect pads are electrically coupled to the RF circuit to conduct the RF energy, the first pair of electrical interconnect pads being noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the circuit board.
1 more element
A method comprising:
- fabricating an interposer circuit board having a first pair of conductive paths spaced to form a radio frequency (RF) transmission line, and having a first pair of electrical interconnect pads with solderable surfaces being noncircular and elongated on a common axis, wherein the first pair of electrical interconnect pads are electrically coupled to the RF transmission line;
- and
- electrically coupling an integrated circuit device to the interposer circuit board, wherein the electrically coupling comprises performing a solder reflow operation to allow solder to flow in a direction of the common axis of the first pair of electrical interconnect pads.
Dependencies are inferred from the claim text.