Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYeongkwon KO, Un-Byoung KANG, Jaekyung YOO, Teak Hoon LEE
Life of this patent
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Abstract
A semiconductor package including a package substrate, a connection substrate on the package substrate and having on a lower corner of the connection substrate a recession that faces a top surface of the package substrate, a semiconductor chip on the connection substrate, a plurality of first connection terminals connecting the connection substrate to the semiconductor chip, and a plurality of second connection terminals connecting the package substrate to the connection substrate. The recession is laterally spaced apart from the second connection terminals.
Claims20
A semiconductor package comprising:
- a substrate having a recession at a first lower corner of the substrate, the first lower corner being a corner where a first sidewall of the substrate and a bottom surface of the substrate cross;
- a semiconductor chip disposed on the substrate;
- and
- a plurality of connection terminals disposed between the substrate and the semiconductor chip, and laterally spaced apart from the recession,
- wherein a distance between each of the plurality of connection terminals and a first line is greater than a distance between the first line and a point where the recession and the bottom surface of the substrate meet, the first line being a line including the first sidewall and an extension of the first sidewall.
A semiconductor package comprising:
- a substrate having a recession at a first lower corner of the substrate, the first lower corner being a corner where a first sidewall of the substrate and a bottom surface of the substrate cross;
- a logic chip disposed on a top surface of the substrate;
- a chip stack disposed on the top surface of the substrate, and including a plurality of memory chips that are vertically stacked;
- and
- a plurality of connection terminals disposed between the substrate and the logic chip, and disposed between the substrate and the chip stack, the plurality of connection terminals being laterally spaced apart from the recession,
- wherein a first vertical length of the recession is greater than a second vertical length of the recession, the first vertical length being a vertical length between the bottom surface of the substrate and a first point of the recession, the second vertical length being a vertical length between the bottom surface of the substrate and a second point of the recession, a distance between the second point and a first line being greater than a distance between the first point and the first line, the first line being a line including the first sidewall and an extension of the first sidewall.
A connection substrate comprising:
- a base substrate having a top surface, a bottom surface and a first sidewall extending between the top surface and the bottom surface,
- a plurality of through vias penetrating the base substrate;
- and
- a plurality of lower pads disposed on the bottom surface of the base substrate,
- wherein the base substrate has a recession at a first lower corner, the first lower corner being a corner where the first sidewall of the base substrate and the bottom surface of the base substrate cross.
Dependencies are inferred from the claim text.