Semiconductor package structure and method of manufacturing the same

A method of manufacturing a semiconductor package structure comprising:

• providing a substrate;
• providing a first chip on the substrate along a second direction perpendicular to a surface of the substrate;
• providing a second chip on the first chip, the second chip comprising an overhanging portion protruding with respect to the first chip in a first direction parallel to the surface of the substrate;
• providing a support on the second chip and exposing a bonding pad included in the second chip;
• providing a bonding wire to connect the bonding pad included in the second chip to a bonding pad included in the substrate;
• and
• providing a molding layer on the substrate and encapsulating the first chip, the second chip, and the bonding wire.

A semiconductor package structure, comprising:

• a substrate;
• a first chip on the substrate;
• a second chip on the first chip;
• a third chip on the second chip;
• a plurality of bonding wires connecting the first chip, the second chip, and the third chip to bonding pads included in the substrate, respectively;
• a first support between the first chip and the second chip;
• and
• a molding layer on the substrate,
• wherein the second chip comprises an overhanging portion protruding with respect to first chip in a first direction parallel to a surface of the substrate.