Arrangements of conductive fingers and methods of making the same

A semiconductor device comprising:

• active regions extending in a first direction;
• in a first metal layer on a first side of the active regions, first segments including as follows,
• a first rail extending in the first direction, and
• first fingers extending from the first rail in a second direction substantially perpendicular to the first direction, and
• the first fingers extending across one or more of the active regions;
• and
• the first rail and the first fingers representing a first comb arrangement in which the first fingers representing first tines of the first comb arrangement and the first rail representing a spine of the first comb arrangement.

A method of manufacturing a semiconductor device, the method comprising:

• forming active regions extending in a first direction;
• and
• in a first metal layer on a first side of the active regions, forming first segments including as follows,
• forming first and second rails extending in the first direction, and
• forming first fingers between the first and second rails,
• each of the first fingers extending in a second direction substantially perpendicular to the first direction, and
• the first fingers extending across one or more of the active regions;
• and
• the first and second rails and the first fingers representing a ladder arrangement in which the first fingers representing rungs of the ladder arrangement and the first and second rails representing siderails of the ladder arrangement.