Packaged electronic device having high thermal dissipation comprising a plurality of power transistors and manufacturing process therof

A device, comprising:

• a C-shaped leadframe including a first extension opposite a second extension, a first surface of the leadframe extending between the first and second extensions, the first and second extensions each has a first surface transverse a second surface of the leadframe, the second surface being opposite the first surface of the leadframe;
• a first die coupled to the first surface of the leadframe;
• a first lead coupled to the first die, the first lead including a first external contact region;
• a second die coupled to the first surface of the leadframe, the second die spaced from the first die;
• a second lead coupled to the second die, the second lead including a second external contact region;
• and
• a packaging mass on the leadframe, the first and second external contact regions are exposed from the packaging mass.

A device, comprising:

• a C-shaped leadframe, including:
• a first recess having a first surface, the leadframe having a second surface opposite the first surface;
• a first extension transverse the second surface;
• and
• a second extension opposite the first extension and transverse the second surface, the recess being between the first and second extensions;
• a plurality of dice in the first recess and coupled to the first surface of the first recess, each die of the plurality of dice spaced from each other;
• a plurality of leads in the first recess and having an external contact region, each die having a respective lead coupled to the respective die;
• and
• a packaging mass on the leadframe, the external contact regions are exposed from the packaging mass.