Semiconductor device

A semiconductor device comprising:

• a substrate;
• at least one semiconductor element provided over an upper surface of the substrate;
• a P electrode electrically connected to the semiconductor element and provided to extend outward from a first side surface of the substrate in plan view;
• an AC electrode electrically connected to the semiconductor element and provided to extend outward from a second side surface opposite the first side surface in plan view;
• a first connecting electrode electrically connected to the semiconductor element and the AC electrode and provided to extend outward from at least one of a third side surface intersecting with the first side surface and a fourth side surface opposite the third side surface in plan view;
• and
• a second connecting electrode electrically connected to the semiconductor element and provided to extend outward from at least one of the third side surface and the fourth side surface in plan view, wherein
• the first connecting electrode does not overlap any of the P electrode and the AC electrode in plan view above the substrate, and
• the second connecting electrode does not overlap any of the P electrode and the AC electrode in plan view above the substrate.