Carrier substrate and manufacturing method of semiconductor package using same

A carrier substrate which has a circular disk shape and is transparent, comprising:

• a first surface;
• a second surface opposite to the first surface;
• an inclined surface that extends along an edge of the first surface, has an inclination angle from the first surface, and is inclined toward the second surface;
• and
• a side surface that extends from an edge of the inclined surface to an edge of the second surface,
• wherein the inclination angle satisfies the following expression:
• arcsin
• ⁡
• (
• n
• a
• /
• n
• s
• )
• ≤
• a
• <
• 90
• ⁢
• °
• ,
• [
• Expression
• ]
• and
• in the expression, a, na, and ns are the inclination angle in degrees, the refractive index of air, and the refractive index of the carrier substrate, respectively.

A method of manufacturing a semiconductor package, comprising:

• preparing a carrier substrate, the carrier substrate having a circular disk shape, including an inclined surface extending along an edge, and defining a notch groove having the shape of a cut at the edge;
• bonding a wafer structure onto the carrier substrate;
• aligning the carrier substrate;
• processing the wafer structure;
• and
• debonding the carrier substrate,
• wherein in the aligning of the carrier substrate,
• a position of the notch groove is detected by radiating light onto the inclined surface such that light incident on the inclined surface is reflected thereby.