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US 2025/0167018 A1Published application
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorManabu HONMA
Life of this patent
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Abstract
A substrate processing apparatus includes a first processing chamber configured to collectively perform first processing on a plurality of substrates held by a substrate holder in a shelf-like shape, a load lock chamber located below the first processing chamber and having an interior communicating with an inside of the first processing chamber, and a driving mechanism configured to move the substrate holder up and down and horizontally.
Claims19
A substrate processing apparatus, comprising:
- a first processing chamber configured to collectively perform a first processing on a plurality of substrates held by a substrate holder in a shelf-like shape;
- a load lock chamber located below the first processing chamber and having an interior communicating with an inside of the first processing chamber;
- and
- a driving mechanism configured to move the substrate holder up and down and horizontally.
1 more element
A substrate processing method, comprising:
- moving a substrate holder holding a plurality of substrates in a shelf-like shape to a processing position;
- collectively performing processing on the plurality of substrates held by the substrate holder at the processing position;
- after the performing the processing, moving the substrate holder to an unloading position immediately below the processing position;
- moving the substrate holder located at the unloading position to a transfer position shifted in a horizontal direction from the unloading position;
- and
- taking the plurality of substrates held by the substrate holder at the transfer position out of the substrate holder.
3 more elements
Dependencies are inferred from the claim text.