Resin sealing device and resin sealing method

A resin sealing device which resin-seals an electronic component of a workpiece comprising a base material and the electronic component, the resin sealing device comprising:

• a resin sealing mold which resin-seals the electronic component by molding a resin material onto the workpiece;
• a workpiece accommodation part capable of accommodating at least one of the workpieces;
• a conveyance line for conveying the workpiece supplied from the workpiece accommodation part to the resin sealing mold;
• and
• a measurement part provided in the workpiece accommodation part and measures a weight of the workpiece.

A resin sealing method which resin-seals an electronic component of a workpiece comprising a base material and the electronic component, the resin sealing method comprising:

• (a) a step of supplying the workpiece from a workpiece accommodation part capable of accommodating at least one of the workpiece pieces onto a workpiece support part;
• (b) a step of conveying the workpiece supplied onto the workpiece support part from the workpiece accommodation part to a conveyance line using a pickup device;
• (c) a step of conveying the workpiece to a resin sealing mold via the conveyance line;
• and
• (d) a step of resin sealing the electronic component by molding a resin material onto the workpiece by the resin sealing mold,
• wherein (a) or (b) comprises a step of calculating a weight of the workpiece by a measurement part provided in at least one among the workpiece accommodation part, the workpiece support part, and the pickup device.