US 2025/0167015 A1 · APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Abstract

The inventive concept relates to an apparatus for manufacturing a semiconductor package and a method of manufacturing a semiconductor package. According to embodiments, the method of manufacturing a semiconductor package may include preparing a substrate including upper conductive pads on an upper surface of the substrate, preparing a first semiconductor chip including first solder balls, wherein a first dielectric layer covering sidewalls of the first solder balls is on a lower surface of the first semiconductor chip, disposing the first semiconductor chip on the substrate such that the first solder balls are on the upper conductive pads, and bonding the first solder balls to the upper conductive pads by applying an alternating current electric field to the first dielectric layer.

Claims20

Dependent claims

A method of manufacturing a semiconductor package, the method comprising:

preparing a substrate including upper conductive pads on an upper surface of the substrate;
preparing a first semiconductor chip including first solder balls, the first semiconductor chip including a first dielectric layer covering sidewalls of the first solder balls on a lower surface of the first semiconductor chip;
disposing the first semiconductor chip on the substrate such that the first solder balls are on the upper conductive pads;
and
bonding the first solder balls to the upper conductive pads by applying an alternating current electric field to the first dielectric layer.

2 more elements

A method of manufacturing a semiconductor package, the method comprising:

preparing a bonding apparatus including
a bonding chuck, the bonding chuck including a first electrode,
a bonding head, the bonding head including a second electrode, and
an alternating current power generator electrically connecting the first electrode to the second electrode;
disposing a substrate on the bonding chuck, the substrate including upper conductive pads;
preparing a semiconductor chip including solder balls, the semiconductor chip including a dielectric layer covering sidewalls of the solder balls and exposing lower surfaces of the solder balls, and the dielectric layer on a lower surface of the semiconductor chip;
disposing the semiconductor chip on the substrate by using the bonding head such that the solder balls are provided on the upper conductive pads;
and
bonding the solder balls to the upper conductive pads by applying an alternating current voltage to the first electrode and the second electrode.

6 more elements

Dependencies are inferred from the claim text.

Apparatus for manufacturing semiconductor package and method of manufacturing semiconductor package

Life of this patent

Apparatus for manufacturing semiconductor package and method of manufacturing semiconductor package

Life of this patent

Abstract

Claims20