Substrate processing apparatus and substrate processing method using the same

A substrate processing apparatus, comprising:

• a stage configured to support a substrate;
• a rotation driving portion configured to rotate the stage around a first axis;
• a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis;
• and
• a second nozzle arm disposed on the first nozzle arm and configured to rotate around the second axis,
• wherein the first nozzle arm comprises:
• a first nozzle supporting member extended parallel to the stage;
• a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape;
• and
• a first nozzle coupled to the first connection member and extended in a vertical direction.

A substrate processing method, comprising:

• placing a substrate in a substrate processing apparatus;
• and
• processing the substrate,
• wherein the processing of the substrate comprises:
• spraying, from a first nozzle, organic solvent onto a stage of the substrate processing apparatus;
• spraying, from a second nozzle, deionized (DI) water toward a center region of the stage;
• and
• spraying, from a third nozzle, a chemical solution,
• wherein the first nozzle is coupled to a first connection member, the first connection member being coupled to an end of a first nozzle supporting member, the first connection member having a stepwise shape, the first nozzle supporting member being extended toward the center region of the stage and parallel to the stage, a first nozzle arm of the substrate processing apparatus comprising the first nozzle supporting member, the first connection member, and the first nozzle, the first nozzle arm being disposed on the stage to rotate around a second axis perpendicular to the top surface of the stage,
• wherein a second nozzle arm of the substrate processing apparatus comprises the second nozzle and the third nozzle, the second nozzle arm being disposed on the stage to rotate around a third axis parallel to the second axis, and
• wherein the substrate processing apparatus comprises a rotation driving portion rotating the stage around a first axis perpendicular to a top surface of the stage.